About Microbond
The project aims to develop a methodology and curriculum for qualification of bonding processes personnel.
It will address three bonding technologies which are the most used in electronics (Adhesive Bonding, Eutectic Bonding and Thermosonic Bonding), and the development will consist of:
specific curriculum, adequate work load for each topic, learning and teaching materials (course support, presentations, videos, etc.) and evaluation tool.
Partners
Last 03th and 04st of November 2016 the kick off meeting of the project was performed.
At present the Consortium is working on the elaboration of the didactic material (a dedicated brand new book) at support of the course.