About Microbond

The project aims to develop a methodology and curriculum for qualification of bonding processes personnel.
It will address three bonding technologies which are the most used in electronics (Adhesive Bonding, Eutectic Bonding and Thermosonic Bonding), and the development will consist of:
specific curriculum, adequate work load for each topic, learning and teaching materials (course support, presentations, videos, etc.) and evaluation tool.

ASR EWF ISQ IIS PROGRESS CESOL

Partners

Project Output

The main activities of the projects are:
* Elaboration of a draft guideline for training and qualification
of bonding personnel*
* Development and implementation of a new innovative toolkit of training for bonding personnel
(learning materials, evaluation tool, short term course for trainers and pilot seminars for target groups)*

Ionel Danut Savu
ASR BULEVARDUL MIHAI VITEAZU 30 300222 (TIMISOARA)
Phone.: +40 723 684262
Mobile: +34 618 28 79 61
danut.savu@ymail.com asr@asr.ro